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AXT7, 8
PRODUCT TYPES
Mated height
Number of pins
Socket
Part number
Header
Inner carton
Packing
Outer carton
40
50
AXT740124
AXT750124
AXT840124
AXT850124
1.0mm
60
AXT760124
AXT860124
3,000 pieces
6,000 pieces
70
80
AXT770124
AXT780124
AXT870124
AXT880124
Notes: 1. Order unit: For volume production: 1-inner-box (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales of?ce.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales of?ce.
3. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Speci?cations
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
Conditions
Electrical
characteristics
Mechanical
characteristics
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Soldering heat resistance
Storage temperature
150V AC for 1 min.
Min. 1,000M ? (initial)
Max. 100m ?
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.165N/pin contacts × pin contacts
Min. 0.49N/pin contacts
–55 ° C to +85 ° C
Peak temperature: 260 ° C or less (on the surface of
the PC board around the connector terminals)
300 ° C within 5 sec. 350 ° C within 3 sec.
–55 ° C to +85 ° C (product only)
–40 ° C to +50 ° C (emboss packing)
No short-circuiting or damage at a detection current of 1 mA
when the speci?ed voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
speci?ed by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Infrared re?ow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature ( ° C)
Time (minutes)
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100M ? ,
contact resistance max. 100m ?
1
2
3
–55 ? 0 3
85 + 30
30
Max. 5
30
4
–55 ? 0 3
Max. 5
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H 2 S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100M ? ,
contact resistance max. 100m ?
24 hours,
insulation resistance min. 100M ? ,
contact resistance max. 100m ?
48 hours,
contact resistance max. 100m ?
Bath temperature 40 ± 2 ° C,
humidity 90 to 95% R.H.
Bath temperature 35 ± 2 ° C,
saltwater concentration 5 ± 1%
Bath temperature 40 ± 2 ° C, gas concentration 3 ± 1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Unit weight
Insertion and removal life
50 times
40 pin contact type: Socket: 0.04 g Header: 0.02 g
Repeated insertion and removal speed of max. 200 times/
hours
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au ?ash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ACCTB27E 201204-T
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